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Advanced Microwave Components
SKYWORKS US MICROWAVES CHIP CAPACITORS CROSS REFERENCE
 
SC00081029 USMC1200_100V_0P8pF-20% SKYWORKS CAPACITOR SC00081029 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1200_100V_0P8pF-20%
SC01020912 USMC1200_100V_1P2pF-20% SKYWORKS CAPACITOR SC01020912 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1200_100V_1P2pF-20%
SC01080912 USMC1200_100V_1P8pF-20% SKYWORKS CAPACITOR SC01080912 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1200_100V_1P8pF-20%
SC00261029 USMC1200_100V_2P6pF-20% SKYWORKS CAPACITOR SC00261029 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1200_100V_2P6pF-20%
SC00381029 USMC1200_100V_3P8pF-20% SKYWORKS CAPACITOR SC00381029 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1200_100V_3P8pF-20%
SC00561029 USMC1200_100V_5P6pF-20% SKYWORKS CAPACITOR SC00561029 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1200_100V_5P6pF-20%
SC00681029 USMC1200_100V_6P8pF-20% SKYWORKS CAPACITOR SC00681029 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1200_100V_6P8pF-20%
SC00821007 USMC1000_100V_8P2pF-20% SKYWORKS CAPACITOR SC00821007 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1000_100V_8P2pF-20%
SC00815218 USMC1800_100V_8P2pF-20% SKYWORKS CAPACITOR SC00815218 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1800_100V_8P2pF-20%
SC01000710 USMC1000_100V_100pF-20% SKYWORKS CAPACITOR SC01000710 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1000_100V_100pF-20%
SC01000912 USMC1200_100V_100pF-20% SKYWORKS CAPACITOR SC01000912 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1200_100V_100pF-20%
SC01001518 USMC1800_100V_100pF-20% SKYWORKS CAPACITOR SC01001518 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1800_100V_100pF-20%
SC01500912 USMC1200_100V_150pF-20% SKYWORKS CAPACITOR SC01500912 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1200_100V_150pF-20%
SC01501518 USMC1800_100V_150pF-20% SKYWORKS CAPACITOR SC01501518 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1800_100V_150pF-20%
SC02215018 USMC1800_100V_220pF-20% SKYWORKS CAPACITOR SC02215018 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1800_100V_220pF-20%
SC03315018 USMC1800_100V_330pF-20% SKYWORKS CAPACITOR SC03315018 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1800_100V_330pF-20%
SC04701518 USMC1800_100V_470pF-20% SKYWORKS CAPACITOR SC04701518 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1800_100V_470pF-20%
SC06815018 USMC1800_100V_680pF-20% SKYWORKS CAPACITOR SC06815018 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC1800_100V_680pF-20%
SC10002430 USMC3000_100V_101pF-20% SKYWORKS CAPACITOR SC10002430 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC3000_100V_101pF-20%
SC33303440 USMC4000_100V_333pF-20% SKYWORKS CAPACITOR SC33303440 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC4000_100V_333pF-20%
SC50004450 USMC5000_100V_501pF-20% SKYWORKS CAPACITOR SC50004450 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC5000_100V_501pF-20%
SC99906068 USMC6800_100V_102pF-20% SKYWORKS CAPACITOR SC99906068 CROSSRFERENCE USMICROWAVES MIS CHIP CAPACITORS USMC6800_100V_102pF-20%
 
 
   
 
ALL US MICROWAVES PRODUCTS ARE AVAILABLE IN MILITARY GRADE (H) AND SPACE GRADE (K). MIS chip capacitors are designed to be used in chip and wire hybrid circuits as RF bypass, DC blocks coupling filter elements and microwave circuit resonant elements. When used as resonant elements in oscillators, Q has to be as high as possible while the temperature coefficient has to be as small as possible. U. S. MICROWAVES advanced semiconductor and thin film technologies allow for an important reduction of series resistance DCR, increased SRF, low insertion loss and skin effect at higher microwave frequencies. High quality dielectrics with low loss factors translate into an increased Q, very high insulation resistance, high breakdown voltage, long term stability under bias at high temperatures. US Microwaves MIS chip capacitors exhibit Q values in excess of 3000 in X band, insertion loss less than 0.08dB through Ku band and series resistance much lower than conventional ceramic chip capacitors. DCR of less than 0.1 ohms is typical for most chip sizes. MIS capacitors with silicon nitride/silicon oxide dielectric, also known as MNOS capacitors exhibit high stability, low temperature coefficients, low leakage in nA range and high BV from 25, 50 and 100 to 300V. MIS Chip capacitors are available in a wide range of die sizes, capacitance values and breakdown voltages.

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Silicon Chip Capacitors MIS MOS MNOS CXXXX - Series of chip capacitors are designed to be used as RF bypass, DC blocks coupling filter elements and microwave circuit resonant elements. When used as resonant elements in oscillators, Q has to be as high as possible while the temperature coefficient has to be as small as possible. U. S. MICROWAVES advanced semiconductor and thin film technologies allow for an important reduction of the series resistance DCR that is increasing the SRF of the capacitor. High quality dielectrics with low loss factors translate into an increased Q. The microwave capacitors are manufactured on high conductivity silicon substrates. The dielectrics are SiO2 and Si3N4 and the capacitors are available with single or dual dielectric. The die thickness is 0.005 +/- 0.001. The top plate of the capacitors is 99.99% electroplated or sputtered gold with a TiW barrier that withstands half hour at 400 deg. C without loss of adhesion. Minimum 1.5 micrometers of Au enhance the top plate bond ability. The backside of the die is metalized with Ti/Pt/Au, which is compatible with most die attaching methods. The MNOS type of capacitors has low voltage coefficients, low TCC, high Q and high dielectric breakdown. Capacitors are 100% visually inspected and packaged in waffle packs, gel packs or vials. US MICROWAVESmanunufacturer of high reliability microwave integrated circuits MIC technology. US Microwave offers a multitude of applied thin film products and microwave semiconductor devices: manufactures and supplies high quality standard microwave thin film circuits and microwave devices using advanced technical ceramics and semiconductor materials; Products include RF micro devices for hybrid chip and wire applications; microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky diodes, PIN diodes, tunnel diodes, SRD diodes, varactor diodes and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe. SEMICONIX Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays contain a large number of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic components: photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington, high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zenner diodes, TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET s and MOSFETs, MCT (MOS controlled tyristors), IGBT. Semiconix 's Divisions:HTE Labs Provides Wafer Foundry, R&D support and Specialty Wafer Fab Processing to customers from semiconductors and microelectronics industry. Wafer foundry includes the following processes: 20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support is provided in the following fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump. SEMICONWELL designs and manufacture standard and custom Integrated Passive Networks - IPN for the personal computer, telecommunications, industrial controls, automotive, avionics. The Integrated Passive Networks are a sum of resistors, capacitors, inductors, diodes and schottky diodes and are available in through hole and surface mounted packages. SEMICONWELL is suppling integrated termination, filters and ESD protection for use in mobile phones, PDAs, personal computers, notebooks, routers, hubs, internet appliances. Standard Devices - Most standard devices include resistors, capacitors, inductors, diodes and schottky diodes networks and are inventoried by the designated part numbers and can be ordered on line, from factory or from distributors. Custom Devices - Custom IPN (Integrated Passive Networks) are manufactured from customer's prints upon request. US MICROWAVES develops, manufactures and supplies high quality standard microwave thin film circuits and microwave devices including RF bipolars for hybrid chip and wire applications as follows: microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky,PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe.